US 11,122,693 B2Granted

Method for forming laminated circuit board

AssigneePi-Crystal Incorporation

InventorsJunichi Takeya, Seiichiro Yamaguchi, Masataka Itoh

Life of this patent

Estimating the term…

Loading patent…

Abstract

Described are processes for developing laminated circuit boards, as well as the resulting circuit boards themselves. Accordingly, at least two circuit boards at least partially overlap each other, and at least one through-hole is formed in an overlapping region thereof. The through-hole is filled with an electrically-conductive material, forming a through-via that enables the circuit boards to be electrically connected. When a circuit on each circuit board is laid out so that a part thereof reaches a region in which the through-via is to be formed, then that part of the circuit can be electrically connected to the through-via. Thus, portions of the circuits on the circuit boards can be electrically connected to each other via common through-vias to realize an integrated device in which the circuits on the laminated circuit boards function.

Claims7

Dependent claims

A method for forming a laminated circuit board in which a plurality of flexible circuit boards are laminated, each flexible circuit board being provided with a printable electronic device that is formed on a flexible film using a printing technique, wherein

an organic semiconductor circuit is formed on at least one of the plurality of flexible circuit boards,
the plurality of flexible circuit boards each have at least one side surface and are arranged so that a region in a vicinity of the one side surface of one flexible circuit board among the plurality of flexible circuit boards overlaps a region in a vicinity of the one side surface of at least one other of the plurality of flexible circuit boards,
wherein each of the plurality of flexible circuit boards has a top side and a bottom side, and an area of the bottom side of two of the flexible circuit boards is less than an area of the top side of the at least one other flexible circuit board, and
electrical connection of the one flexible circuit board with the at least one other flexible circuit board is made via a through-via that is formed in a vicinity of one edge of the one flexible circuit board and a region in a vicinity of the one edge of the at least one other flexible circuit board, or via an electrically-conductive material arranged on the one side surface of the flexible circuit boards.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 15/676,472Filed 14 Aug 2017 · continuation
Priority: JP JP2015-02701313 Feb 2015
Published: US 2017/0374746 A128 Dec 2017
Granted: 14 Sep 2021
Term ends: Not estimatedThe source records don’t support an estimate.

Classification27 codes

H05K 3/361
Assembling printed circuits with other printed circuits: assembling flexible printed circuits with other printed circuits
H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections
H05K 1/116
Via connections; Lands around holes or via connections: lands, clearance holes or other lay-out details concerning the surrounding of a via
H05K 1/118
Printed elements for providing electric connections to or between printed circuits: specially for flexible printed circuits, e.g. using folded…

Family

PCT/JP2016/055734Parent of this continuation · filed 12 Feb 2016
US 2017/0374746 A1Pre-grant publication · published 28 Dec 2017
US 11,122,693 B2This patent

From the US filing history. Foreign family members aren’t listed.

Timeline

Citations

Open elsewhere

Building an agent or pulling many patents? Use the API or MCP server instead of scraping pages. Get an API key