Printed wiring board

A printed wiring board, comprising:

• a first substrate which has a slit and includes at least one first electrode, the slit being formed in the first substrate and passing through the first substrate from one first primary surface to an other first primary surface opposite the one first primary surface;
• and
• a second substrate having one second primary surface and an other second primary surface opposite the one second primary surface, the second substrate including (i) a support inserted in the slit so as to intersect with the first substrate and (ii) at least one second electrode on the support, the first electrode on the first substrate and the second electrode being bonded by a solder, wherein
• a dimension of the slit in a longitudinal direction is greater than a sum of a design dimension of the support in a longitudinal direction, a maximum design dimension tolerance of the support in the longitudinal direction, and a maximum design dimension tolerance of the slit in the longitudinal direction,
• a first slit gap is formed between an end of the support in the longitudinal direction and an end of the slit in the longitudinal direction,
• a first width of the first slit gap of the slit is less than a second width, the first width being a width of the first slit gap in a direction intersecting with the longitudinal direction of the slit, the second width being a width of a region of the slit, other than the first slit gap,
• the first width is less than a substrate thickness which is spacing between the one second primary surface and the other second primary surface of the second substrate, and
• the longitudinal length of the first slit gap is longer than the longitudinal length of the region of the second substrate, other than the support inserted in the slit.

A printed wiring board, comprising:

• a first substrate which has a slit and includes at least one first electrode, the slit being formed in the first substrate and passing through the first substrate from one first primary surface to an other first primary surface opposite the one first primary surface;
• and
• a second substrate having one second primary surface and an other second primary surface opposite the one second primary surface, the second substrate including (i) a support inserted in the slit so as to intersect with the first substrate and (ii) at least one second electrode on the support, the first electrode on the first substrate and the second electrode being bonded by a solder, wherein
• a dimension of the slit in a longitudinal direction is greater than a sum of a design dimension of the support in a longitudinal direction, a maximum design dimension tolerance of the support in the longitudinal direction, and a maximum design dimension tolerance of the slit in the longitudinal direction,
• a first slit gap is formed between an end of the support in the longitudinal direction and an end of the slit in the longitudinal direction,
• a plurality of slits comprising the slit are formed in the first substrate, spaced apart from each other in a longitudinal direction of the first substrate, and
• a second slit gap is formed between a pair of slits adjacent to each other among the plurality of slits, the second slit gap connecting the pair of slits.