Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

A resin composition comprising:

• (i) a reactant of a cyanate compound (A) and a polybutadiene (B) and/or (ii) a reactant of a polymerized product of the cyanate compound (A) and the polybutadiene (B);
• and
• a maleimide compound (C),
• wherein the maleimide compound (C) comprises at least one selected from a group consisting of 2,2′-bis{4-(4-maleimidophenoxy)-phenyl}propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, a maleimide compound (C1) represented by the following formula (1-1), and a maleimide compound (C2) represented by the following formula (1-2),
• wherein R5 each independently represents a hydrogen atom or a methyl group, and n1 represents an integer of 1 or more,
• wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group, and n is an average value and satisfies 1<n≤5, and
• wherein the polybutadiene (B) is an unmodified polybutadiene, and wherein the polybutadiene (B) comprises a 1,2-adduct and a 1,4-adduct at a mass ratio of 1:3 to 3:1.