Tamper-respondent sensors with liquid crystal polymer layers

A tamper-respondent assembly comprising:

• a circuit board;
• an enclosure assembly mounted to the circuit board to enclose at least one electronic component coupled to the circuit board within at least one sealed chamber of a secure volume, the enclosure assembly comprising:
• a tamper-respondent sensor, the tamper-respondent sensor being a rigid three-dimensional multilayer sensor structure comprising:
• multiple liquid crystal polymer layers in solid form;
• at least one tamper-detect circuit, the at least one tamper-detect circuit comprising one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers;
• and
• wherein the rigid three-dimensional multilayer sensor structure is a single, molded, three-dimensional multilayer sensor structure;
• and
• a monitor circuit disposed within the secure volume to monitor the at least one tamper-detect circuit of the tamper-respondent sensor for a tamper event;
• and
• wherein the tamper-respondent sensor includes a connection tab extending therefrom to facilitate electrically connecting the at least one tamper-detect circuit to the monitor circuit, and the circuit board includes a notch in a surface thereof within the secure volume, the connection tab of the tamper-respondent sensor extending, at least in part, into the notch in the surface of the circuit board in operative position connecting the at least one tamper-detect circuit to the monitor circuit.

A tamper-respondent assembly comprising:

• a circuit board comprising a first side and a second side, the first side and the second side being opposite sides of the circuit board;
• multiple electronic components, including at least one first electronic component coupled to the first side of the circuit board and at least one second electronic component coupled to the second side of the circuit board;
• a first enclosure assembly mounted to the first side of the circuit board to enclose the at least one first electronic component coupled to the first side of the circuit board within a first sealed chamber of a secure volume, the first enclosure assembly comprising:
• a first tamper-respondent sensor, the first tamper-respondent sensor being a first three-dimensional multilayer sensor structure comprising:
• multiple liquid crystal polymer layers;
• and
• at least one first tamper-detect circuit, the at least one first tamper-detect circuit comprising one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers;
• a second enclosure assembly mounted to the second side of the circuit board to enclose the at least one second electronic component coupled to the second side of the circuit board within a second sealed chamber of the secure volume, the second enclosure assembly comprising:
• a second tamper-respondent sensor, the second tamper-respondent sensor being a second three-dimensional multilayer sensor structure comprising:
• multiple liquid crystal polymer layers;
• and
• at least one second tamper-detect circuit, the at least one second tamper-detect circuit comprising one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers of the second tamper-respondent sensor;
• and
• a monitor circuit disposed within the secure volume to monitor the at least one first tamper-detect circuit of the first tamper-respondent sensor and to monitor the at least one second tamper-detect circuit of the second tamper-respondent sensor for a tamper event.