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US 11,122,679 B2Granted
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHiroki Okada, Hee Jung Jung
Life of this patent
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Abstract
A printed circuit board includes an insulating body, a wiring structure at least disposed on the insulating body; and a shielding portion including a conductive via disposed around the wiring structure of the insulating body. The conductive via includes first and second metal layers having different degrees of magnetic permeability.
Claims18
A printed circuit board, comprising:
- an insulating body;
- a wiring structure at least disposed on the insulating body;
- and
- a shielding portion including a conductive via disposed around the wiring structure of the insulating body,
- wherein the conductive via comprises first and second metal layers having different degrees of magnetic permeability.
2 more elements
Dependencies are inferred from the claim text.