US 11,122,677 B2Granted

Printed circuit board structure and method for inductive noise cancellation

AssigneeMarvell Asia Pte Ltd

InventorsShaowu Huang, Dance Wu

Life of this patent

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Abstract

A printed circuit board (PCB) for coupling to an automotive Ethernet connection includes first and second board conduction traces, a first off-board conductor coupled to the first trace at a first contact point spaced from an edge of the PCB, and extending over the PCB from the first contact point to the edge for connection a first off-board conduction path, a second off-board conductor coupled, adjacent to the first off-board conduction path, to the second trace at a second contact point spaced from the edge of the PCB, and extending over the PCB from the second contact point to the edge for connection the second off-board conduction path. The off-board paths are a power path and a signal path. A loop in one of board conduction traces inductively couples that one the board conduction traces to a respective one of off-board conduction paths.

Claims21

Dependent claims

A printed circuit board configured to be coupled to an automotive Ethernet connection having a first off-board conduction path and a second off-board conduction path, the printed circuit board comprising:

a first board conduction trace;
a first off-board conductor coupled to the first board conduction trace at a first contact point spaced from an edge of the printed circuit board, and extending over the printed circuit board from the first contact point to the edge of the printed circuit board for connection the first off-board conduction path;
a second board conduction trace;
a second off-board conductor coupled, adjacent to the first off-board conduction path, to the second board conduction trace at a second contact point spaced from the edge of the printed circuit board, and extending over the printed circuit board from the second contact point to the edge of the printed circuit board for connection the second off-board conduction path;
wherein:
one path of (1) the second off-board conduction path, and (2) the first off-board conduction path, is a power path and another path of (1) the second off-board conduction path, and (2) the first off-board conduction path, is a signal path;
and
at least one loop in at least one of (a) the first board conduction trace, and (b) the second board conduction trace, is configured to inductively couple the respective one of (a) the first board conduction trace and (b) the second board conduction trace to a respective one of (1) the second off-board conduction path and (2) the first off-board conduction path.

5 more elements

An integrated circuit pckage configured to be coupled to an automotive Ethernet connection having a first off-package conduction path and a second off-package conduction path the integrated circuit pckage comprising:

a substrate;
a firt package conduction trace on the substrate;
a first off-package conductor coupled to the first pakage conduction trae at a first contact point spaced from an edge of the substrate, and extending over the substrate from the first contact point to the edge of the substrate for connection the first off-package conduction path;
second package conduction trace;
and
a second off-package conduction path, to the second package conduction trace at a second contact point spaced from the edge of the substrate, and extending over the substrate from the second contact point to the edge of the substrate for connection the second off-package conduction path;
wherein:
one path of (1) the second off-package donduction path, and (2) the first off-package conduction path, is a pwer path and another path of (1) the second off-package conduction path, and (2) the first off-package conduction path, is a signal path;
and
at least one loop in at least one of (a) the first package conduction trace, and (b) the second package conduction trace, is configured to inductively couple the respective one of (a) the first package conduction trace and (b) the second package conduction trace to a respective one of (1) the second off-package conduction path and (2) the first off-package conduction path.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/949,783Filed 13 Nov 2020 · us provisional application
Priority: 15 Nov 2019
Published: US 2021/0153342 A120 May 2021
Granted: 14 Sep 2021
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

H05K 1/0228
Reduction of cross-talk, noise or electromagnetic interference: compensation of cross-talk by a mutually correlated lay-out of printed circuit…
H04B 5/24
Characterised by the transmission technique; characterised by the transmission medium: inductive coupling
H04B 5/79
Specially adapted for specific purposes: for data transfer in combination with power transfer
H05K 1/0233
Using auxiliary mounted passive components or auxiliary substances: filters, inductors or a magnetic substance

Family

Application62/936,244Us provisional application · filed 15 Nov 2019
US 2021/0153342 A1Pre-grant publication · published 20 May 2021
US 11,122,677 B2This patent

From the US filing history. Foreign family members aren’t listed.

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