PCB with coin and dielectric layer

A printed circuit board comprising:

• a first, second, third, fourth, fifth and sixth conductive layer;
• a first laminate between the first and second conductive layers;
• a first prepreg layer between the second and third conductive layers;
• a dielectric layer between the first prepreg layer and the second conductive layer, the first dielectric layer having a thickness between 1 and 40 um;
• a second laminate between the third and fourth conductive layers;
• a second prepreg layer between the fourth and fifth conductive layers;
• a third laminate between the fifth and sixth conductive layers;
• a coin for heat dispersion located underneath the dielectric layer;
• a cavity for receiving a component above the coin;
• and
• a plating within the cavity to connect the coin with the second conductive layer, wherein the plating extends less than 50 um above the second conductive layer and wherein the dielectric layer eliminates a need for electroless copper plating to electrically couple the second conductive layer and the coin because the dielectric layer enables electrolytically added copper plating to grow directly across it.

A method of manufacturing a printed circuit board, the method comprising:

• laminating a multi-stack printed circuit board having first, second and third conductive layers, a first non-conductive layer between the first and second conductive layers, a second non-conductive layer between the second and third conductive layers, a dielectric layer between the second conductive layer and the second non-conductive layer, a coin underneath the dielectric layer;
• routing a cavity for receiving a component;
• and
• plating the cavity to connect the coin and the second conductive layer, wherein the plating extends less than 50 um above the second conductive layer.