Power module having an embedding structure

An electronic system, comprising:

• a board;
• a load attached to the board;
• a power module attached to the board, configured to provide dc power to the load and comprising:
• an embedding structure comprising an electrically insulating body;
• a first semiconductor chip embedded in the electrically insulating body and comprising a vertical low-side power transistor;
• and
• a second semiconductor chip comprising a lateral high-side power transistor,
• wherein the lateral high-side power transistor is electrically connected to the vertical low-side power transistor through one or more first electrically conductive paths embedded in the electrically insulating body to form a switch node of a half bridge circuit configured to supply an output voltage to the load, the switch node being electrically connected to a terminal of the embedding structure through one or more second electrically conductive paths embedded in the electrically insulating body;
• and
• a controller configured to control operation of the power module and thereby regulate the dc power provided to the load.

A power module, comprising:

• an embedding structure comprising an electrically insulating body;
• a first semiconductor chip embedded in the electrically insulating body and comprising a vertical low-side power transistor;
• and
• a second semiconductor chip comprising a lateral high-side power transistor,
• wherein all signal I/O and input power connections to the second semiconductor chip are provided by electrically conductive paths embedded in the electrically insulating body,
• wherein the vertical low-side power transistor and the lateral high-side power transistor are electrically connected within the embedding structure to form a switch node of a half bridge circuit,
• wherein a terminal at a side of the electrically insulating body provides a point of external electrical contact for the switch node.