Contact pad features
AssigneeMagnecomp Corporation
InventorsKuen Chee Ee, Peter Hahn, David Glaess, Keith A. Vanderlee
Life of this patent
Estimating the term…
Abstract
An electrical connection structure for connecting a piezoelectric element and an electrical circuit to each other with a conductive adhesive is described. The electrical connection structure includes an epoxy, a conductive component surrounded by the epoxy, and a trace feature implemented on top of the electrical connection structure.
Claims13
An electrical connection structure for connecting a piezoelectric element and an electrical circuit to each other with a conductive adhesive, the electrical connection structure comprising:
- an epoxy;
- at least one conductive component surrounded by the epoxy;
- and
- at least one trace feature implemented on top of the electrical connection structure configured to receive an end of a piezoelectric element, the at least one trace feature is configured to constrain the epoxy and the at least one conductive component.
An actuated assembly comprising:
- at least one piezoelectric microactuator mounted near a first end of the dual stage actuated assembly;
- a flexure mounted near a second end of the dual stage actuated assembly, wherein the flexure includes an electrical circuit including a contact pad configured to carry a driving voltage to the at least one piezoelectric microactuator,
- the copper contact pad including:
- an epoxy;
- at least one conductive component surrounded by the epoxy;
- and
- at least one trace feature implemented on top of the electrical connection structure, the at least one trace feature is in electrical contact with the at least one conductive component and configured to reduce thermal expansion.
A dual stage actuated assembly comprising:
- at least one piezoelectric microactuator mounted near a first end of the dual stage actuated assembly;
- a flexure mounted near a second end of the dual stage actuated assembly, wherein the flexure includes an electrical circuit including a contact pad configured to carry a driving voltage to the at least one piezoelectric microactuator,
- the contact pad includes:
- an epoxy;
- at least one conductive component surrounded by the epoxy;
- and
- at least one depression feature implemented on top of the electrical connection structure, the at least one depression feature is in electrical contact with the at least one conductive component and configured to reduce thermal expansion, and the at least one depression feature is configured to constrain the epoxy and the at least one conductive component.
Dependencies are inferred from the claim text.