Cooling electronic devices in a data center

A method for cooling a plurality of electronic heat-generating devices in a data center comprising:

• enclosing a plurality of server tray assemblies in a volume defined by a first container, each of the server tray assemblies comprising:
• the plurality of electronic heat-generating devices, and
• an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices, the immersion cooling system comprising a working fluid in thermal communication with the one or more electronic heat-generating devices;
• immersing the plurality of server tray assemblies in a liquid phase of a non-conductive coolant;
• operating the one or more electronic heat-generating devices to generate heat;
• transferring the generated heat from the one or more electronic heat-generating devices to the working fluid of the immersion cooling system;
• transferring the generated heat to the working fluid contained in an inner volume of a vapor chamber of the immersion cooling system that is mounted to and in conductive thermal contact with the one or more electronic heat-generating devices;
• vaporizing, with the transferred heat, at least a portion of a liquid phase of the working fluid into a vapor phase of the working fluid;
• circulating the vapor phase from the inner volume into one or more condenser tubes positioned in thermal contact with the working fluid within an inner volume of the vapor chamber and in thermal contact with the liquid phase of the non-conductive coolant;
• and
• transferring the generated heat from the working fluid of the immersion cooling system to the liquid phase of the non-conductive coolant.

A submergible server tray assembly, comprising:

• a motherboard;
• at least one processor coupled to the motherboard;
• and
• an immersion cooling system mounted to and in conductive thermal contact with the processor, the immersion cooling system comprising a working fluid in thermal communication with the processor, where the motherboard, processor, and immersion cooling system are configured to submerge in a dielectric cooling liquid, the immersion cooling system further comprising:
• a housing mounted to and in conductive thermal contact with the processor;
• and
• one or more condenser tubes positioned in thermal contact with the working fluid within an inner volume of the housing and extending from the housing, where each of the one or more condenser tubes is configured to submerge in the dielectric cooling liquid, and each condenser tube comprises:
• an inlet open to the inner volume;
• an outlet open to the inner volume;
• and
• a conduit between the inlet and the outlet that extends from the inner volume, through a wall of the housing, and external to the housing.

A data center cooling system, comprising:

• an outer container that defines a first volume;
• an inner container that defines a second volume and is positioned within the first volume, the inner container comprising an air outlet that comprises an airflow path between the first and second volumes;
• a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment;
• at least one server tray assembly comprising:
• a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant;
• and
• an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices, the immersion cooling system comprising a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant,
• wherein the outer container comprises a pressure relief valve configured to vent a portion of air, vented from the second volume through the air outlet and into the first volume, to the ambient environment;
• a base that comprises a first portion of the first volume;
• and a chimney that extends vertically from the base and comprises a second portion of the first volume that is in fluid communication with the first portion.

A method for cooling electronic heat-generating devices in a data center, comprising:

• enclosing a plurality of server tray assemblies in a volume defined by a first container, each of the server tray assemblies comprising:
• a plurality of electronic heat-generating devices, and
• an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices, the immersion cooling system comprising a working fluid in thermal communication with the one or more electronic heat-generating devices;
• immersing the plurality of server tray assemblies in a liquid phase of a non-conductive coolant;
• enclosing the first container in a second volume of a second container, the non-conductive coolant filling at least a portion of the first and second volumes;
• sealing the liquid phase of the non-conductive coolant from an ambient environment;
• operating the one or more electronic heat-generating devices to generate a heat load;
• transferring the generated heat load from the one or more electronic heat-generating devices to the working fluid of the immersion cooling system;
• transferring the generated heat from the working fluid of the immersion cooling system to the liquid phase of the non-conductive coolant;
• forming an airflow path between the first and second volumes;
• and
• venting a portion of air from the first volume, through the airflow path, through the second volume and to the ambient environment.