Damping covers for power inverter modules and integrated power electronics modules utilizing the same

An integrated power electronics module (IPEM), comprising:

• an IPEM casing defining therein an internal chamber;
• a power inverter module (PIM) attached to the IPEM casing and located within the internal chamber;
• a component attached to the IPEM casing;
• and
• a damping cover attached to the IPEM casing adjacent the PIM such that the PIM is enclosed between the damping cover body and the IPEM casing,
• the damping cover including:
• an aluminum foam core including a top surface corresponding to a top side of the damping cover and a bottom surface corresponding to a bottom side of the damping cover,
• a polymeric material covering the top surface and/or the bottom surface of the aluminum foam core, and
• a non-porous aluminum outer layer covering top surface and/or a bottom surface of the polymeric material and forming outermost exterior surfaces of the top and/or bottom sides of the damping cover.

An integrated power electronics module (IPEM), comprising:

• an IPEM casing with first and second internal portions separated by a partition;
• a component located inside the first portion;
• a power inverter module (PIM) located inside the second portion;
• and
• a damping cover adjacent the PIM and sealingly mounted to the IPEM casing to enclose therebetween the PIM, the damping cover including:
• an aluminum foam core including a top surface corresponding to a top side of the damping cover and a bottom surface corresponding to a bottom side of the damping cover,
• a polymeric material over-molding covering the top and bottom surfaces of the aluminum foam core, and
• an aluminum plate layer covering top and bottom surfaces of the polymeric material over-molding and forming an outermost exterior surface of the top side of the damping cover and an outermost exterior surface of the bottom side of the damping cover.