Semiconductor storage device

A semiconductor storage device, comprising:

• a substrate having a first principal surface and a second principal surface, the second principal surface being arranged on an opposite side of the first principal surface;
• a first memory and a controller arranged on the first principal surface;
• a second memory arranged on the second principal surface;
• a first conductive cover that is provided on a side of the first principal surface and that covers at least a part of the first memory and the controller;
• and
• a second conductive cover that is provided on a side of the second principal surface and that covers at least a part of the second memory,
• wherein the substrate has
• a first notched portion arranged at a first position in a first edge of the substrate,
• a second notched portion arranged at a second position in a second edge of the substrate,
• a third notched portion arranged at a third position in the first edge of the substrate, and
• a fourth notched portion arranged at a fourth position in the second edge of the substrate,
• the first conductive cover has
• a first top plate portion,
• a first side plate portion,
• a second side plate portion,
• a first claw portion that is extended from a lower end of the first side plate in a direction intersecting with the first principal surface and that is interlocked with the first notched portion,
• a second claw portion that is extended from a lower end of the second side plate in the direction intersecting with the first principal surface and that is interlocked with the second notched portion,
• the second conductive cover has
• a second top plate portion,
• a third side plate portion,
• a fourth side plate portion,
• a third claw portion that is extended from a lower end of the third side plate in a direction intersecting with the second principal surface and that is interlocked with the third notched portion, and
• a fourth claw portion that is extended from a lower end of the fourth side plate in the direction intersecting with the second principal surface and that is interlocked with the fourth notched portion,
• the substrate, the first conductive cover, and the second conductive cover each have a shape complying with a form factor,
• the first notched portion is arranged at the first position in a first outer edge of the shape,
• the second notched portion is arranged at the second position in a second outer edge of the shape,
• the third notched portion is arranged at the third position in the first outer edge of the shape, and
• the fourth notched portion is arranged at the fourth position in the second outer edge of the shape.