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US 11,116,083 B2Granted
Electronic component embedded by laminate sheet
AssigneeAT&S (China) Co. Ltd.
InventorsAnnie Tay, Mikael Tuominen
Life of this patent
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Abstract
A component carrier includes a core having a recess, an electronic component arranged in the recess, a laminated electrically insulating sheet covering at least part of the core and of the electronic component and filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess, and a further electrically insulating layer structure laminated on top of the sheet.
Claims18
A component carrier, comprising:
- a core having a recess;
- an electronic component arranged in the recess, wherein a vertical thickness of the electronic component is larger than a vertical thickness of the core;
- a laminated electrically insulating sheet covering at least part of a top main surface of the core, the laminated electrically insulating sheet with a through hole or indentation at the position of the electronic component, the laminated insulating sheet having a thickness approximately equal to a difference of the vertical thickness of the electronic component and the vertical thickness of the core, the laminated electrically insulating sheet filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess;
- and
- an electrically insulating layer structure formed on top of the laminated electrically insulating sheet, so that the electrically insulating layer structure covers the electronic component;
- wherein an electrically conductive layer structure formed on the electrically insulating layer structure covers vertical walls of the core defining the recess, the electronic component and the recess;
- and
- wherein a build-up on an upper main surface of the laminated electrically insulating sheet is substantially symmetrical to another build-up on a lower main surface of the core, the electronic component and the laminated electrically insulating sheet.
5 more elements
A component carrier, comprising:
- a core having a recess;
- an electronic component arranged in the recess wherein a bottom main surface of the electronic component is flush with a bottom main surface of the core, wherein a vertical thickness of the electronic component is larger than a vertical thickness of the core;
- a laminated electrically insulating sheet covering at least part of a top main surface of the core, the laminated electrically insulating sheet with a through hole or indentation at the position of the electronic component, the laminated electrically insulating sheet having a thickness approximately equal to a difference of the vertical thickness of the electronic component and the vertical thickness of the core and filling a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess;
- and
- an electrically insulating layer structure formed on top of the laminated electrically insulating sheet, so that the electrically insulating layer structure covers the electronic component;
- wherein an electrically conductive layer structure formed on the electrically insulating layer structure covers the electronic component and the recess;
- wherein the laminated electrically insulating sheet covers the upper surface of the electronic component;
- and wherein a build-up on an upper main surface of the laminated electrically insulating sheet is substantially symmetrical to another build-up on a lower main surface of the core, the electronic component and the laminated electrically insulating sheet;
- wherein the component carrier comprises at least one first via that reaches at least partially through the laminated electrically insulating sheet to contact at least partially the upper surface of the electronic component, a further electrically insulating layer structure laminated on a bottom of the core and on a bottom of the electronic component;
- wherein the component carrier comprises at least one second via that reaches at least partially through the further electrically insulating layer structure to contact at least partially the bottom surface of the electronic component.
7 more elements
A method of manufacturing a component carrier, the method comprising:
- providing a core having a recess;
- arranging an electronic component in the recess, wherein a vertical thickness of the electronic component is larger than a vertical thickness of the core;
- laminating an electrically insulating sheet with the core and the electronic component so that material of the electrically insulating sheet covers at least part of the core and fills a gap between a lateral surface of the electronic component and a lateral surface of the core in the recess, wherein the electrically insulating sheet is provided as a recessed layer having a recess to accommodate an upper portion of the electronic component, the electrically insulating sheet having a thickness approximately equal to a difference of the vertical thickness of the electronic component and the vertical thickness of the core;
- laminating a further electrically insulating layer structure on top of the electrically insulating sheet, so that the further electrically insulating layer structure covers the electronic component;
- and
- laminating an electrically conductive layer structure on the electrically insulating layer structure, the electrically conductive layer structure covering the electronic component and extending beyond the recess;
- wherein a build-up on an upper main surface of the laminated electrically insulating sheet is substantially symmetrical to another build-up on a lower main surface of the core, the electronic component and the laminated electrically insulating sheet.
4 more elements
Dependencies are inferred from the claim text.