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US 11,116,077 B2Granted
Wiring board, electronic device, and electronic module
AssigneeKYOCERA Corporation
InventorsTakuo Kisaki, Keisuke Sawada
Life of this patent
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Abstract
A wiring board comprising an insulation substrate comprising a main surface and a penetrating portion that has an insulation property; and an external connection conductor, a portion of which is positioned in the insulation substrate and a different portion of which is exposed at the main surface, wherein the penetrating portion penetrates into the external connection conductor.
Claims20
A wiring board comprising:
- an insulation substrate comprising a main surface and a penetrating portion that has an insulation property;
- and
- an external connection conductor, a portion of which is positioned in the insulation substrate and a different portion of which is exposed at the main surface, the entire external connection conductor embedded within the insulation substrate,
- wherein the penetrating portion is embedded within the insulation substrate and penetrates into the external connection conductor.
1 more element
Dependencies are inferred from the claim text.