Electronic module with an electrically conductive press-fit terminal having a press-fit section

An electronic assembly, comprising:

• an electronic module comprising an electrically conductive press-fit terminal, the electrically conductive press-fit terminal comprising a press-fit section;
• and
• an electric part comprising a contact hole,
• wherein the press-fit section is inserted in the contact hole and plastically deformed therein, such that the press-fit section both mechanically and electrically contacts the electric part in the plastically deformed state,
• wherein the press-fit section comprises a first leg, a second leg, a protrusion, and a recess opposite the protrusion.

An electronic assembly, comprising:

• an electronic module comprising an electrically conductive press-fit terminal, the electrically conductive press-fit terminal comprising a press-fit section;
• and
• an electric part comprising a contact hole,
• wherein the press-fit section is inserted in the contact hole and plastically deformed therein, such that the press-fit section both mechanically and electrically contacts the electric part in the plastically deformed state,
• wherein a module connection section of the electrically conductive press-fit terminal is attached to a circuit carrier of the electronic module or to a terminal metallization layer of a semiconductor chip mounted on the circuit carrier,
• wherein the electrically conductive press-fit terminal is pressed into a sleeve mounted on and electrically connected to the circuit carrier, such that the module connection section electrically and mechanically contacts the sleeve.

A method, comprising:

• providing an electronic module comprising an electrically conductive press-fit terminal, the electrically conductive press-fit terminal comprising a press-fit section;
• providing an electric part comprising a contact hole, the press-fit section having a maximum lateral dimension greater than a minimum lateral width of the contact hole as measured in a same lateral direction as the maximum lateral dimension of the press-fit section;
• pressing the press-fit section into the contact hole such that the press-fit section plastically deforms, and both mechanically and electrically contacts the electric part;
• and
• attaching a module connection section of the electrically conductive press-fit terminal to a circuit carrier of the electronic module or to a terminal metallization layer of a semiconductor chip mounted on the circuit carrier,
• wherein the attaching of the module connection section comprises pressing the electrically conductive press-fit terminal into a sleeve mounted on and electrically connected to the circuit carrier, such that the module connection section electrically and mechanically contacts the sleeve.