Semiconductor light emitting element

A semiconductor light emitting element comprising an n-type or p-type first semiconductor layer on a substrate, an active layer on the upper side of the first semiconductor layer, and a second semiconductor layer on the upper side of the active layer having a conductivity type different from the conductivity type of the first semiconductor layer, the semiconductor light emitting element comprising:

• a first insulating layer formed in a position closer to the substrate than the first semiconductor layer in a first direction orthogonal to a surface of the substrate and formed so as to protrude outward from a first surface of the first semiconductor layer, the first surface of the first semiconductor layer facing the substrate in the first direction;
• a bonding layer including a solder material formed on the upper side of the substrate;
• a first electrode made of a high reflective material located inside the first insulating layer as seen in the first direction and formed so as to be in contact with the first surface directly or via a thin film;
• and
• a second electrode formed so as to be in contact with a surface of the second semiconductor layer opposite to a side of the second semiconductor layer that faces the substrate, wherein
• a first region, where the first surface and the first insulating layer face each other, and a second region, where the first surface and the first electrode face each other, are spaced apart in a second direction parallel to the surface of the substrate,
• a first conductive layer in contact with the first surface in a third region is interposed between the first region and the second region in the second direction, the first conductive layer being formed of a material having higher contact resistance to the first surface as compared to the first electrode, and the first conductive layer being formed to connect a surface of the first electrode that faces the substrate, a side surface of the first electrode, and the third region to one another,
• a second conductive layer, which is formed of a material different from the material of the first conductive layer, and formed so as to be in contact with a surface of the bonding layer opposite to a surface of the bonding layer that faces the substrate,
• a third conductive layer is formed in a position interposed between the first conductive layer and the second conductive layer in the first direction and formed of a material different from the material of the first conductive layer and the second conductive layer,
• the first conductive layer is formed to extend in the second direction so as to be in contact with a surface of the first insulating layer that faces the substrate,
• the third conductive layer is formed in a region including a position facing the first insulating layer in the first direction, and
• a second insulating layer is formed so as to be spaced apart from the first insulating layer in the second direction, the second insulating layer interposed between the third conductive layer and the second conductive layer in a position facing the second electrode in the first direction.

A semiconductor light emitting element comprising an n-type or p-type first semiconductor layer on a substrate, an active layer on the upper side of the first semiconductor layer, and a second semiconductor layer on the upper side of the active layer having a conductivity type different from the conductivity type of the first semiconductor layer, the semiconductor light emitting element comprising:

• a first insulating layer formed in a position closer to the substrate than the first semiconductor layer in a first direction orthogonal to a surface of the substrate and formed so as to protrude outward from a first surface of the first semiconductor layer, the first surface of the first semiconductor layer facing the substrate in the first direction;
• a bonding layer including a solder material formed on the upper side of the substrate;
• a first electrode made of a high reflective material located inside the first insulating layer as seen in the first direction and formed so as to be in contact with the first surface directly or via a thin film;
• and
• a second electrode formed so as to be in contact with a surface of the second semiconductor layer opposite to a side of the second semiconductor layer that faces the substrate, wherein
• a first region, where the first surface and the first insulating layer face each other, and a second region, where the first surface and the first electrode face each other, are spaced apart in a second direction parallel to the surface of the substrate,
• a first conductive layer in contact with the first surface in a third region is interposed between the first region and the second region in the second direction, the first conductive layer formed of a material having higher contact resistance to the first surface as compared to the first electrode, and
• the first conductive layer is formed so as to be in contact with the first semiconductor layer in at least a part of a region facing the first insulating layer in the first direction and to connect a side surface of the first electrode, the third region, and the first region.