Optoelectronic component and method for producing an optoelectronic component

An optoelectronic component comprising:

• a semiconductor layer sequence having an active region configured to emit radiation;
• a dielectric layer;
• a solder layer comprising a first metal arranged on the dielectric layer;
• and
• a seed layer arranged between the solder layer and the dielectric layer,
• wherein the seed layer comprises the first metal and a second metal, wherein the second metal is less noble than the first metal,
• wherein an amount of the second metal in the seed layer is between 0.5 wt % and 10 wt %, and
• wherein the first metal is Au and the second metal is Zn.

An optoelectronic component comprising:

• a semiconductor layer sequence having an active region configured to emit radiation;
• a dielectric layer;
• a solder layer comprising a first metal arranged on the dielectric layer, the solder layer configured to create a bond between the semiconductor layer sequence and an external substrate;
• and
• a seed layer arranged between the solder layer and the dielectric layer, the seed layer being directly adjacent to both the solder layer and the dielectric layer so that no further layers are arranged between the solder layer and the seed layer,
• wherein the seed layer comprises the first metal and a second metal, wherein the second metal is less noble than the first metal,
• wherein an amount of the second metal in the seed layer is between 0.5 wt % and 10 wt %, and
• wherein the first metal is Au and the second metal is Zn.