Array substrate and manufacturing method thereof
AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorsCaiqin Chen, Xing Ming
Life of this patent
Estimating the term…
Abstract
In a method for manufacturing an array substrate, a first photoresist pattern is formed on a buffer layer of a non-display region and the buffer layer uncovered by the first photoresist pattern is removed to form a first via hole in the non-display region. A second via hole is formed on the basis of the first via hole. The second via hole is connected to the first via hole. By forming the first via hole in the non-display region and forming the second via hole on the basis of the first via hole, completeness of film layers is ensured and product yield is improved.
Claims12
A method for manufacturing an array substrate, comprising:
- forming a buffer layer on a substrate, the substrate comprising a display region and a non-display region;
- forming a first photoresist pattern on the buffer layer of the non-display region and removing a part of the buffer layer to form a first via hole in the non-display region;
- forming an insulating layer on the buffer layer of the non-display region and the first via hole;
- and
- forming a second photoresist pattern on the insulating layer of the non-display region and removing a part of the insulating layer to form a second via hole in the non-display region, the second photoresist pattern corresponding to the first via hole and the second via hole connected to the first via hole,
- wherein the insulating layer at least partially covers the first via hole and a cross-sectional area of the second via hole is less than or equal to a cross-sectional area of the first via hole, and
- wherein a thickness of the first via hole is between 0.7 micrometer and 0.9 micrometer and a thickness of the second via hole is between 0.6 micrometer and 0.8 micrometer.
A method for manufacturing an array substrate, comprising:
- forming a buffer layer on a substrate, the substrate comprising a display region and a non-display region;
- forming a first photoresist pattern on the buffer layer of the non-display region and removing a part of the buffer layer to form a first via hole in the non-display region;
- forming an insulating layer on the buffer layer of the non-display region and the first via hole;
- and
- forming a second photoresist pattern on the insulating layer of the non-display region and removing a part of the insulating layer to form a second via hole in the non-display region, wherein the second photoresist pattern corresponds to the first via hole and the second via hole is connected to the first via hole.
Dependencies are inferred from the claim text.