Semiconductor device with conductive cap layer over conductive plug and method for forming the same
AssigneeNanya Technology Corporation
InventorHung-Chi Tsai
Life of this patent
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Abstract
A semiconductor device includes a semiconductor substrate, a first word line and a second word line disposed over the semiconductor substrate, and a conductive plug disposed between the first word line and the second word line. The semiconductor device also includes a conductive cap layer disposed over the conductive plug, wherein a top surface and a portion of a sidewall surface of the conductive plug are covered by the conductive cap layer. The semiconductor device further includes a bit line disposed over the conductive cap layer, wherein the bit line is electrically connected to the conductive plug.
Claims12
A semiconductor device, comprising:
- a semiconductor substrate;
- a first word line and a second word line disposed over the semiconductor substrate;
- a conductive plug disposed between the first word line and the second word line;
- a conductive cap layer directly disposed over the conductive plug, wherein a top surface and a portion of a sidewall surface of the conductive plug are completely covered by and directly contacted with the conductive cap layer;
- a dielectric layer disposed over the first word line and the second word line, wherein the portion of the sidewall surface of the conductive plug protrudes from the dielectric layer, wherein the top surface of the conductive plug is higher than a topmost surface of the dielectric layer;
- and
- a bit line disposed over the conductive cap layer, wherein the bit line is electrically connected to the conductive plug.
A semiconductor device, comprising:
- a semiconductor substrate;
- a first word line and a second word line disposed over the semiconductor substrate;
- a conductive plug disposed between the first word line and the second word line, wherein a sidewall surface of the conductive plug is over the first word line and the second word line;
- a dielectric layer covering the first word line and the second word line, wherein a lower portion of the sidewall surface of the conductive plug is surrounded by the dielectric layer, wherein the top surface of the conductive plug is higher than a topmost surface of the dielectric layer;
- a conductive cap layer directly disposed over the conductive plug, wherein an upper portion of the sidewall surface of the conductive plug is completely surrounded by and directly contacted with the conductive cap layer;
- and
- a bit line disposed over the conductive cap layer, wherein the bit line is electrically connected to the conductive plug.
Dependencies are inferred from the claim text.