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US 11,114,425 B2Granted
Packaging of radiation detectors in an image sensor
AssigneeShenzhen Xpectvision Technology Co., Ltd.
InventorsPeiyan Cao, Yurun Liu, Chongshen Song
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Abstract
Disclosed herein is an image sensor comprising: a first package comprising a plurality of radiation detectors mounted on a printed circuit board (PCB); wherein a dead zone of the first package does not extend between neighboring radiation detectors among the plurality of radiation detectors; wherein the radiation detectors have no guard rings or sidewall doping.
Claims26
An image sensor comprising:
- a first package comprising a plurality of radiation detectors mounted on a printed circuit board (PCB);
- wherein a dead zone of the first package does not extend between neighboring radiation detectors among the plurality of radiation detectors;
- wherein the radiation detectors have no guard rings or sidewall doping;
- wherein each of the radiation detectors comprises an array of pixels;
- wherein pixels on peripheries of the radiation detectors are configured to deduct a contribution of a dark current from energy of a radiation particle incident thereon.
2 more elements
Dependencies are inferred from the claim text.