Back to results
US 11,114,418 B2Granted
Electronic device, method of manufacturing electronic device, and electronic apparatus
AssigneeFujitsu Limited
InventorsTaiki Uemura, Taiji Sakai, Seiki Sakuyama
Life of this patent
Estimating the term…
Abstract
An electronic device includes: a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components; and a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space.
Claims6
An electronic device comprising:
- a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components;
- and
- a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space,
- wherein each of four ends of a specific second electronic component included in the second electronic components is stacked on a different first electronic component included in the first electronic components,
- each of the first electronic components includes a first conduction via penetrating the each of the first electronic components in the stacking direction, and
- each of the second electronic components includes a second conduction via penetrating the each of the second electronic components in the stacking direction, and the second conduction via is electrically connected to the first conduction via.
3 more elements
A method of manufacturing an electronic device, comprising:
- forming a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components;
- and
- forming, over the first layer, a second layer that includes second electronic components in a group which are coupled to the first electronic components, and has a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space,
- wherein each of four ends of a specific second electronic component included in the second electronic components is stacked on a different first electronic component included in the first electronic components,
- each of the first electronic components includes a first conduction via penetrating the each of the first electronic components in the stacking direction, and
- each of the second electronic components includes a second conduction via penetrating the each of the second electronic components in the stacking direction, and the second conduction via is electrically connected to the first conduction via.
3 more elements
An electronic apparatus including an electronic device comprising:
- a first layer that includes first electronic components in a group and has a first through space between adjacent ones of the first electronic components;
- and
- a second layer that is stacked over the first layer and includes second electronic components which are coupled to the first electronic components and a second through space between adjacent ones of the second electronic components, the second through space being partially overlapping with the first through space,
- wherein each of four ends of a specific second electronic component included in the second electronic components is stacked on a different first electronic component included in the first electronic components,
- each of the first electronic components includes a first conduction via penetrating the each of the first electronic components in the stacking direction, and
- each of the second electronic components includes a second conduction via penetrating the each of the second electronic components in the stacking direction, and the second conduction via is electrically connected to the first conduction via.
3 more elements
Dependencies are inferred from the claim text.