Electronic package and method for fabricating the same

A method for fabricating an electronic package, comprising:

• providing a first carrying structure having a first circuit layer and defined with a first surface and a second surface opposing the first surface;
• and
• disposing a package module, a first electronic component and a second electronic component on the first surface of the first carrying structure, wherein the package module and the first electronic component are electrically connected to the first circuit layer, and the second electronic component is stacked on and electrically connected to the first electronic component,
• wherein the first electronic component has a first active surface and a first inactive surface opposing the first active surface, the first inactive surface is adhered to the first surface of the first carrying structure, and a plurality of first electrode pads are disposed on the first active surface, and
• wherein the second electronic component has a second active surface and a second inactive surface opposing the second active surface, the second active surface is disposed on the first active surface of the first electronic component, and a plurality of second electrode pads are disposed on the second active surface and electrically connected to the first electrode pads of the first electronic component.