Chip on wafer on substrate optoelectronic assembly and methods of assembly thereof

A method of assembling an optoelectronic assembly via a CoWos process, the method comprising:

• fabricating an interposer with TSVs, the interposer having opposing first and second sides;
• flip-chip assembling an electronic integrated circuit (EIC) having opposing first and second sides to the first side of the interposer;
• coupling an enclosure to the first side of the interposer, the enclosure having a lid and four sidewalls, and a height greater than a height of the EIC;
• depositing an overmold layer on the first side of the interposer, the overmold layer encapsulating the EIC;
• planarizing the overmold layer, wherein the lid of the enclosure is removed during planarization of the overmold layer, the four sidewalls of the enclosure forming a cavity extending through the overmold layer and exposing a region of the first side of the interposer;
• coupling an optical component to the first side of the interposer within the formed cavity;
• and
• flip-chip assembling the interposer to a first side of a substrate.