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US 11,114,395 B2Granted
Post passivation interconnect
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-An Lin, Alan Kuo, C. C. Chang, Yu-Lung Shih
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Abstract
An integrated circuit (IC) device includes a first passivation layer over a substrate. The IC device further includes a redistribution line over the first passivation layer, wherein the redistribution line has a barrel-shaped profile. The IC device further includes a second passivation layer over the redistribution line. The IC device further includes a polymer layer over the second passivation layer.
Claims20
An integrated circuit (IC) device comprising:
- a first passivation layer over a substrate;
- a redistribution line over the first passivation layer, wherein the redistribution line has a barrel-shaped profile;
- a second passivation layer over the redistribution line, wherein a distance from a bottommost surface of the second passivation layer to the substrate is less than a distance from a bottommost surface of the redistribution line to the substrate;
- and
- a polymer layer over the second passivation layer.
2 more elements
An integrated circuit (IC) device comprising:
- an interconnect structure over a substrate;
- a first passivation layer over the interconnect structure;
- a first post passivation interconnect (PPI) over the first passivation layer;
- a second PPI over the first passivation layer, wherein an aspect ratio of the second PPI is at least 1.5, and the aspect ratio is based on a height of the second PPI and a space between a bottommost surface of the first PPI and a bottommost surface of the second PPI;
- and
- a second passivation layer over the first PPI and the second PPI.
3 more elements
An integrated circuit (IC) device comprising:
- a first passivation layer over a substrate;
- a first post passivation interconnect (PPI) over the first passivation layer, wherein an entire sidewall of the first PPI is curved;
- a second PPI over the first passivation layer, wherein the second PPI is a dummy element;
- and
- a second passivation layer over the first PPI and the second PPI, wherein a spacing between a bottommost surface of the first PPI and a bottommost surface of the second PPI is less than a spacing between a body portion of the first PPI and a body portion of the second PPI.
2 more elements
Dependencies are inferred from the claim text.