Plate-shaped workpiece processing method

A plate-shaped workpiece processing method for dividing a plate-shaped workpiece into a plurality of individual packages along a plurality of crossing division lines, the workpiece including a wiring member having a first surface and a second surface opposite to the first surface, the first surface of the wiring member being partitioned into a plurality of regions by the plurality of crossing division lines, a plurality of terminals formed on each region of the first surface of the wiring member, a plurality of semiconductor chips mounted on the second surface of the wiring member by bonding, and a sealing layer formed on the second surface of the wiring member so as to seal the plurality of semiconductor chips, the sealing layer being formed from a sealing compound, the plate-shaped workpiece processing method comprising:

• a protective member attaching step of attaching a protective member to the first surface of the wiring member, the protective member having an adhesive layer for protecting the plurality of terminals;
• a dividing step of dividing the plate-shaped workpiece and the protective member along each division line of the plurality of crossing division lines after performing the protective member attaching step, thereby obtaining the individual packages in a condition where the protective member is attached to each package of the plurality of individual packages;
• a shield layer forming step of forming a conductive shield layer on an outer surface of each package of the plurality of individual packages after performing the dividing step;
• a protective member peeling step of peeling the protective member from each package of the plurality of individual packages after performing the shield layer forming step;
• and
• a workpiece holding step of holding the workpiece through the protective member on a holding jig after performing the protective member attaching step,
• wherein the protective member is held under suction on the holding jig.