Semiconductor device packages and methods of manufacturing the same

A semiconductor device package, comprising:

• a substrate;
• a first dielectric layer having a top surface, a bottom surface, and a lateral surface disposed over the substrate;
• a conductive element disposed in the first dielectric layer;
• a first conductive layer disposed on the bottom surface and the lateral surface of the first dielectric layer and electrically connected with the conductive element;
• a conductive via disposed on the substrate;
• a second dielectric layer disposed between the first conductive layer and the conductive via;
• a third dielectric layer disposed on the bottom surface of the first dielectric layer and having a bottom surface and a lateral surface;
• a fourth dielectric layer disposed between the second conductive layer and the conductive via;
• and
• a second conductive layer disposed on the bottom surface and the lateral surface of the third dielectric layer,
• wherein the second dielectric layer encloses the conductive via, and
• wherein the first conductive layer has a portion extending toward the conductive via along a bottom surface of the conductive element,
• wherein the second conductive layer extends through the second dielectric layer and is electrically connected with the conductive element, and
• wherein the fourth dielectric layer encloses the conductive via.