Mold and transfer molding apparatus

A transfer molding apparatus, comprising:

• a mold;
• a transfer part introducing a resin to the mold, and the transfer part configured to be movable between an initial position and a post-movement position;
• and
• a sensor,
• the mold including
• a substrate clamping surface contacting a surface of a processing substrate;
• a cavity recessed from the substrate clamping surface;
• a suction part recessed from the substrate clamping surface;
• a vent being provided on a path between the cavity and the suction part, communicating with the cavity, being recessed from the substrate clamping surface to a vent depth, and being used as an exhaust path of a gas inside the cavity;
• an intermediate cavity being provided between the vent and the suction part on the path, communicating with the vent, and being recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth;
• and
• an shut-off pin opening and closing the path and being provided between the intermediate cavity and the suction part on the path,
• the transfer part filling the resin into the cavity in an open state of the shut-off pin,
• the sensor positioned between an input of the vent and the intermediate cavity and sensing that at least a portion of the resin has passed through the vent and reached at least a portion of the intermediate cavity,
• the shut-off pin being set to a closed state after the sensing by the sensor.