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US 11,114,312 B2Granted
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsBenoit Besancon, Alexandre Mas, Karine Saxod
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.
Claims17
A method for manufacturing, comprising the following steps:
- placing at least one insert having opposite faces in a cavity of a mold having opposite surfaces, said insert positioned such that at least part of one of the opposite faces of the insert makes contact with at least part of one of the opposite surfaces of the mold;
- injecting a coating material into said cavity;
- and
- setting the coating material in order to obtain an overmolded substrate within which said insert is at least partly included to form an encapsulation cover comprising the at least one insert and at least a portion of said overmolded substrate.
1 more element
A method for manufacturing, comprising the following steps:
- placing at least one insert having opposite faces in a two-part mold having a first part and a second part defining a cavity, the first and second parts having opposite surfaces, said insert positioned such that at least part of one of the opposite faces of the insert makes contact with at least part of one of the opposite surfaces of the two-part mold;
- injecting a coating material into said cavity;
- and
- setting the coating material in order to obtain an overmolded substrate that at least partly overmolds said insert to form an encapsulation cover comprising the at least one insert and at least a portion of said overmolded substrate.
1 more element
A method for manufacturing, comprising the following steps:
- placing a plurality of inserts, each insert having opposite faces, in spaced apart positions within a two-part mold having a first part and a second part defining a cavity, the first and second parts have opposite surfaces, said insert positioned such that at least part of one of the opposite faces of the insert makes contact with at least part of one of the opposite surfaces of the two-part mold;
- injecting a coating material into said cavity;
- setting the coating material in order to obtain a set coating material providing a substrate that at least partly overmolds said plurality of inserts to form an overmolded structure;
- and
- dicing the overmolded structure at locations between inserts to form a plurality of encapsulation covers, wherein each encapsulation cover comprises at least one insert and at least a portion of the set coating material.
2 more elements
Dependencies are inferred from the claim text.