Chip package structure and method for forming the same

A method for forming a chip package structure, comprising:

• forming a wiring layer in a dielectric layer, wherein the dielectric layer is made of polymer;
• forming a conductive structure over the dielectric layer, wherein the conductive structure is electrically connected to the wiring layer;
• forming a first molding layer over the dielectric layer to surround the conductive structure;
• removing the first molding layer over the conductive structure;
• forming a redistribution structure over the first molding layer and the conductive structure, wherein the redistribution structure is in direct contact with the conductive structure;
• bonding a chip structure to the redistribution structure,
• removing a portion of the dielectric layer to form openings after bonding the chip structure;
• and
• forming bumps in the openings of the dielectric layer.

A method for forming a chip package structure, comprising:

• forming a wiring layer in a dielectric layer, wherein the dielectric layer is made of polymer;
• forming a conductive structure over a top surface of the dielectric layer, wherein the conductive structure is electrically connected to the wiring layer;
• forming a molding layer over the dielectric layer, wherein the conductive structure is exposed from the first molding layer;
• forming a redistribution structure over the molding layer and the conductive structure, wherein the conductive structure is electrically connected to the redistribution structure;
• bonding a chip structure to the redistribution structure;
• and
• forming a bump in direct contact with a bottom surface of the dielectric layer to form the chip package structure, wherein the bump is exposed from the chip package structure.