A method of manufacturing an integrated circuit (IC) device, the method comprising:
- forming a photoresist layer on a substrate;
- and
- exposing the photoresist layer to light by using a photolithographic apparatus including a light generator,
- wherein the light generator includes:
- a chamber having a plasma generation space,
- an optical collector in the chamber, the optical collector having an aperture, and
- a debris shielding assembly between the optical collector and the plasma generation space in the chamber,
- wherein the debris shielding assembly includes:
- a protective film facing the optical collector and being spaced apart from the optical collector with a protected space therebetween, the protected space including an optical path, the protective film having a through hole in a center region of the protective film, and the through hole being spaced apart from the aperture with the protected space therebetween, and
- a protective frame attaching the protective film to the optical collector, the protective frame to support the protective film and to shield the protected space from the plasma generation space.