Back to results
US 11,113,076 B2Granted
Coordinating power transitions between a smart interconnect and heterogeneous components
AssigneeNorth Sea Investment Co. Ltd.
InventorsMeng Yan, Omar Mahmoud Afdal Alnaggar, Myron O. Shak, Soheil Gharahi, William Kelsey
Life of this patent
Estimating the term…
Abstract
Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
Claims22
An apparatus comprising:
- a semiconductor interconnect substrate electrically coupled to one or more components mounted thereon, wherein the semiconductor interconnect substrate includes within it a logic to handle sequence and/or control of power functions for the one or more components, wherein the semiconductor interconnect substrate includes within it a microcontroller unit;
- and
- an interface coupled to the semiconductor interconnect substrate, wherein the interface is operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode,
- wherein the logic, to handle sequence and/or control of power functions for the one or more components, comprises:
- a power management unit;
- a power kernel and controller coupled to the power management unit, and a memory coupled to the power kernel and controller,
- wherein the power kernel and controller are operable to sequence one or more reset signals to reset the microcontroller unit, and
- wherein the semiconductor interconnect substrate includes within it a microelectromechanical system-based temperature compensated crystal oscillator coupled to the microcontroller unit.
5 more elements
A method comprising:
- placing a semiconductor interconnect substrate into a power-up mode, the semiconductor interconnect substrate being electrically coupled to one or more components mounted thereon, wherein the semiconductor interconnect substrate includes within it a logic to handle sequence and/or control of power functions for the one or more components, wherein the semiconductor interconnect substrate includes within it a microcontroller unit;
- and
- applying a configuration command set to the one or more components in a normal operation mode subsequent to the power-up mode,
- wherein the logic, to handle sequence and/or control of power functions for the one or more components, comprises:
- a power management unit;
- a power kernel and controller coupled to the power management unit, and a memory coupled to the power kernel and controller,
- wherein the power kernel and controller are operable to sequence one or more reset signals to reset the microcontroller unit, and
- wherein the semiconductor interconnect substrate includes within it a microelectromechanical system-based temperature compensated crystal oscillator coupled to the microcontroller unit.
5 more elements
A system comprising a power source and component coupled to the power source, the component including:
- a semiconductor interconnect substrate electrically coupled to one or more components mounted thereon, wherein the semiconductor interconnect substrate includes within it a logic to handle sequence and/or control of power functions for the one or more components, wherein the semiconductor interconnect substrate includes within it a microcontroller unit;
- and
- an interface coupled to the semiconductor interconnect substrate, wherein the interface is operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode,
- wherein the logic, to handle sequence and/or control of power functions for the one or more components, comprises:
- a power management unit;
- a power kernel and controller coupled to the power management unit, and a memory coupled to the power kernel and controller,
- wherein the power kernel and controller are operable to sequence one or more reset signals to reset the microcontroller unit, and
- wherein the semiconductor interconnect substrate includes within it a microelectromechanical system-based temperature compensated crystal oscillator coupled to the microcontroller unit.
5 more elements
Dependencies are inferred from the claim text.