Microtransfer molding process and patterned substrate obtainable therefrom

Abstract

Microtransfer molding process and patterned substrate obtainable therefrom The present invention pertains to the field of nanoimprint lithography (NIL) processes and more specifically to a MicroTransfer Molding process used for providing a sol-gel patterned layer on a substrate without any residual layer. The process comprises the following successive steps: (a) impregnating a soft mold with a sol-gel layer coated on a first substrate, under conditions of a relative solvent pressure adjusted such that the layer swells by vapor absorption between 10 and 60% vol., so as to fill the mold under the action of capillary forces, (b) removing the first substrate, (c) if needed, equilibrating the gel within the mold cavities, under a relative solvent pressure between 0 and 95%, in order to allow it to swell, (d) applying the swollen gel onto a second substrate to be patterned, (e) thermally treating this assembly so as to rigidify the gel, (f) removing the mold, and (g) curing the gel into a ceramic, thus forming a patterned substrate.

Dependencies are inferred from the claim text.