Method of installing electronic component, display device and display system

A method of installing an electronic component, comprising:

• positioning the electronic component including an electronic component side line connection part at a vertical end surface of a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line, the electronic component side line connection part facing the vertical end surface, the substrate side line connection part at the end of the line being substantially coplanar with the vertical end surface of the substrate stack and the substrate side line connection part at the end of the line not extending beyond the vertical end surface of the substrate stack;
• forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part, the auto-agglutination solder including a thermosetting resin and one or more solder particles;
• positioning the auto-agglutination solder to contact the substrate side line connection part at the end of the line;
• and
• pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder to electrically connect the substrate side line connection part and the electronic component side line connection part to each other by the auto-agglutination solder,
• wherein the line includes at least one of Al and Cu, and the substrate side line connection part includes at least one of Sn, Pb and Zn.