IC tray and test jig
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorAkihiro Hayashida
Life of this patent
Estimating the term…
Abstract
According to one embodiment, an IC tray mounting thereon IC packages to be tested includes a plurality of through-holes provided at a pitch equal to a pitch of terminals of the IC packages, and IC package mounting places on which the IC packages are to be mounted. The through-holes are provided in the IC package mounting places correspondingly to arrangement positions of the terminals of the IC packages. The IC package mounting places are provided correspondingly to a region of a test board where a plurality of test pins used for an electrical test to one of the IC packages are arranged.
Claims6
A test jig comprising:
- an IC tray mounting thereon IC packages to be tested;
- a test board that includes support tables and electrode pads, the support tables being provided with test pins to be in contact with terminals of the IC packages mounted on the IC tray, the electrode pads being connected to the test pins through wiring lines;
- and
- a tray transfer mechanism configured to grip the IC tray while pressing through a pad a first face of the IC tray on which the IC packages are to be mounted, and to transfer the IC tray to the test board, wherein
- the IC tray includes
- a plurality of through-holes provided at a pitch equal to a pitch of terminals of the IC packages, and
- IC package mounting places on which the IC packages are to be mounted, and
- the through-holes are provided in the IC package mounting places correspondingly to arrangement positions of the terminals of the IC packages, and
- a plurality of test pins of the test board used for an electrical test to one of the IC packages are provided correspondingly to the IC package mounting places.
Dependencies are inferred from the claim text.