Probe head and electronic device testing system

A system for testing electronic devices, comprising:

• one or more probe heads, including:
• a probe axis extending along a length of the probe head;
• a probe core including a first metal, the probe core including:
• a core surface having a first dimension, wherein the first dimension is perpendicular to the probe axis;
• a probe tip extending from the core surface along the probe axis, wherein:
• the probe tip has a second dimension that is perpendicular to the probe axis;
• and
• the second dimension is less than the first dimension of the core surface;
• a cladding layer including a second metal, wherein the cladding layer is coupled around a perimeter of the probe core;
• and
• wherein the probe tip extends beyond the cladding layer, and the cladding layer extends beyond the core surface;
• a probe holder including one or more probe sockets, wherein the probe sockets are configured to receive the one or more probe heads;
• and
• a substrate including one or more contacts configured to engage with the one or more probe heads, wherein the one or more contacts transmit an electrical signal between the substrate and the one or more probe heads.

A method for manufacturing an electronic device testing system, comprising:

• etching a cladding layer of a probe head with a first etchant to remove a portion of the cladding layer from a probe core of the probe head, wherein the cladding layer includes a first metal;
• etching the probe core with a second etchant to remove a portion of the probe core, wherein the probe core includes a second metal;
• and
• wherein the cladding layer extends beyond a probe core surface of the probe core, and the cladding layer extends beyond the core surface.