Saw based optical sensor device and package including the same

An optical sensor package comprising:

• a printed circuit board comprising a first bonding pad area and a second bonding pad area;
• an optical sensor device disposed on the printed circuit board and connected to the first bonding pad area through wire bonding;
• an integrated circuit (IC) chip disposed on the printed circuit board and connected to the second bonding pad area;
• molding portions surrounding the optical sensor device and molding the second bonding pad area and the IC chip;
• and
• a transparent substrate disposed on the molding portions and forming an air gap with the optical sensor device,
• wherein the optical sensor device comprises:
• a substrate comprising a first light sensing area and a temperature sensing area and comprising a piezo electric material;
• a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap between the first input electrode and the first output electrode;
• a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode;
• and
• a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap between the second input electrode and the second output electrode, and
• wherein the second delay gap is exposed to air.