Partial submersion testing for plating defects
AssigneeInternational Business Machines Corporation
InventorsEric J Campbell, James Anderl, Sarah K. Czaplewski-Campbell, Jason T. Wertz, Brandon M. Kobilka
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AssigneeInternational Business Machines Corporation
InventorsEric J Campbell, James Anderl, Sarah K. Czaplewski-Campbell, Jason T. Wertz, Brandon M. Kobilka
Estimating the term…
A method and a system for detecting defects in plated-through hole by partially submerging a printed circuit board in a fluid bath. The method includes partially submerging a printed circuit board on a first side and measuring a capillary height difference within a plated-through hole and the surrounding fluid bath. The method further includes partially submerging the printed circuit board on a second side and measuring a second capillary height difference within the plated-through hole and the surrounding fluid bath. The method also includes comparing the measured values with predetermined values to determine the quality of the plated-through hole.
A method of detecting defects on a plated-through hole using a fluid bath, the method comprising:
A computer program product for detecting defects on a plated-through hole using a fluid bath, the computer program product comprising a computer readable storage medium having program instruction embodied therewith, wherein the program instructions:
A system, comprising:
Dependencies are inferred from the claim text.