Manufacturing apparatus and manufacturing method for semiconductor device

A manufacturing apparatus for a semiconductor device, comprising:

• a substrate holding unit configured to hold a substrate;
• a processing liquid supply unit configured to supply a processing liquid onto the substrate held by the substrate holding unit;
• an electrolytic processing unit disposed to face the substrate holding unit and configured to perform an electrolytic processing on the substrate held by the substrate holding unit;
• and
• a terminal configured to apply a voltage to the substrate while being in contact with the substrate,
• wherein the electrolytic processing unit comprises a main body,
• a direct electrode is provided on a surface of the main body and configured to be brought into contact with the processing liquid supplied onto the substrate to apply a voltage with respect to the substrate;
• and
• an indirect electrode is provided within the main body and is configured to form an electric field in the processing liquid supplied onto the substrate,
• wherein the terminal is held by the main body and is protruded from the surface of the main body.