Deposition equipment and method of fabricating semiconductor device using the same

A deposition equipment comprising:

• a reaction chamber including an upper plate and a container body, the upper plate including a gas supplier for injecting a processing gas;
• a wafer chuck including an upper surface on which a wafer is loaded, in the reaction chamber, with the upper surface of the wafer chuck facing the upper plate;
• and
• a processing gas shielding section which prevents the processing gas from being adsorbed to the upper surface of the wafer chuck and is disposed between the upper plate and the wafer chuck in a state in which the wafer is removed from the wafer chuck,
• wherein the processing gas shielding section includes a shutter which is plate-like,
• the shutter includes a first region, a second region, and a third region between the first region and the second region, and
• the first region of the shutter includes a gas discharge section for jetting a purging gas toward the wafer chuck, and the third region of the shutter does not include a gas discharge section for jetting the purging gas toward the wafer chuck.