Adhesives for assembling components of inert material
AssigneeSicpa Holding SA
InventorDavide Ciampini
Life of this patent
Estimating the term…
Loading patent…
AssigneeSicpa Holding SA
InventorDavide Ciampini
Estimating the term…
The present invention relates to adhesive formulations for bonding materials, comprising 40 to 80 wt.-% of an epoxy monomer, and 15 to 30 wt.-% of an oxetane monomer, and 0.1 to 10 wt.-% of an adhesion promotor, and 0.1 to 5 wt.-% of a sensitizer, and 1 to 10 wt.-% of a radiation and temperature activable photoinitiator or a mixture of a photoinitiator and a thermal initiator. Further, the present invention relates to a method for bonding at least two parts of which one is at least an inert material, comprising the steps applying to one part an adhesive formulation as described, placing another part to be bond on the one part, exposing the parts to UV light radiation and heat treating of the part.
An adhesive formulation for bonding two materials at least one of which being an impregnated or impermeabilized material, comprising
A method for bonding at least two parts of which one is at least an impregnated or impermeabilized material, comprising the following steps:
Dependencies are inferred from the claim text.