Polishing composition, method for producing polishing composition, and polishing method
AssigneeFujimi Incorporated
InventorsShota Suzuki, Yoshihiro Izawa
Life of this patent
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Abstract
The present invention provides a polishing composition which can polish an object to be polished at a high polishing speed and with fewer scratches (defects). The present invention is a polishing composition containing silica of which a maximum peak height in a weight change rate distribution curve obtained by thermogravimetric measurement in a range of 25° C. or higher and 250° C. or lower is −0.011 or more and less than 0, a pH at 25° C. of the polishing composition being less than 6.0.
Claims13
A polishing composition comprising silica of which a maximum peak height in a weight change rate distribution curve obtained by thermogravimetric measurement in a range of 25° C. or higher and 250° C. or lower is −0.011 or more and less than 0, a pH at 25° C. of the polishing composition being less than 6.0, wherein:
- a true density of the silica is more than 1.70 g/cm3 and 2.18 g/cm3 or less;
- the silica has an average primary particle size of 100 nm or less;
- and
- the silica has a degree of association of 1.9 to 5.0.
A method for producing a polishing composition to be used for polishing an object to be polished, the method comprising:
- preparing silica of which a maximum peak height in a weight change rate distribution curve obtained by thermogravimetric measurement in a range of 25° C. or higher and 250° C. or lower is −0.011 or more and less than 0;
- and
- mixing the silica with water, wherein:
- a true density of the silica is more than 1.70 g/cm3 and 2.18 g/cm3 or less;
- the silica has an average primary particle size of 100 nm or less;
- and
- the silica has a degree of association of 1.9 to 5.0.
Dependencies are inferred from the claim text.