Sealing resin composition, electronic component device, and method of manufacturing electronic component device

A sealing resin composition comprising:

• an epoxy resin (A), a curing agent (B) having at least one amino group in one molecule, and an inorganic filler (C), wherein:
• the inorganic filler (C) comprises a first inorganic filler (C1) having an average particle size from 0.1 μm to 20 μm and a second inorganic filler (C2) having an average particle size from 10 nm to 80 nm,
• a value obtained by multiplying a specific surface area of the inorganic filler (C), by a proportion of a mass of the inorganic filler (C) in a solid mass of the sealing resin composition, is 4.0 m2/g or more, and
• the sealing resin composition has a viscosity, at 25° C., from 0.1 Pa·s to 50.0 Pa·s.