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US 11,111,398 B2Granted
Subsurface modified silica materials
AssigneeInternational Business Machines Corporation
InventorsBrandon M. Kobilka, Joseph Kuczynski, Jacob T. Porter, Jason T. Wertz
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Abstract
Methods and compositions related to subsurface modified silica materials are described. The silica materials include silicon- and carbon-containing groups covalently bonded to the silicon-oxygen matrix. The silica materials have tunable permeability, modulus, hardness, flexibility, and elongation. The silica materials are suitable for use as polymer fillers and as functional coatings.
Claims16
An electronic article, comprising:
- a substrate comprising electronic components;
- and
- a coating disposed on the substrate that contains silica particles comprising subsurface organic groups, wherein at least two of the silica particles are bonded directly to a bridging compound having the structure X2Si—R—SiX2, wherein R is selected from the group consisting of polyurethanes, and polyethers, wherein the X groups are —OH groups.
An electronic article, comprising:
- a substrate comprising electronic components;
- and
- a coating disposed on the substrate that contains silica particles comprising subsurface organic groups, wherein the silica particles have a diameter of from 1 nm to 100 nm, wherein at least two of the silica particles are bonded directly to a bridging compound having the structure X2Si—R—SiX2, wherein R is selected from the group consisting of polyurethanes, and polyethers, and wherein the X groups are —OH groups.
An electronic article, comprising:
- a substrate comprising electronic components;
- and
- a coating disposed on the substrate that contains silica particles comprising subsurface organic groups, wherein the silica particles are nanoparticles having a diameter of from 1 nm to 100 nm, and wherein at least two of the silica particles are bonded directly to the same bridging compound having the structure R2Si SiR2, wherein the R groups are —OH groups.
Dependencies are inferred from the claim text.