Electronic device which can be adhered to skin and method for manufacturing the same

A skin-adherable electronic device, comprising:

• a semiconductor circuit unit—the semiconductor circuit unit including a circuit element including at least one of an electrode and an interconnect;
• and a semiconductor device including an insulating layer and an active layer;
• and
• a flexible patch including a plurality of through-holes, wherein the flexible patch can adhere to skin,
• wherein the insulating layer includes a plurality of through-holes corresponding to at least some of the plurality of through-holes of the flexible patch and the interconnect includes a plurality of through-holes corresponding to the plurality of through-holes of the insulating layer,
• wherein the at least some of the plurality of through-holes of the flexible patch, the plurality of through-holes of the insulating layer and the plurality of through-holes of the interconnect include circular through-holes and dumbbell through-holes,
• wherein the through-holes of the flexible patch, the through-holes of the insulating layer and the through-holes of the interconnect are aligned to form apertures, and
• wherein skin surfaces are exposed to an air at the apertures when the said device adheres to a skin.