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US 11,107,881 B2Granted
Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsShao Hsuan Chuang, Huang-Hsien Chang, Min Lung Huang, Yu Cheng Chen, Syu-Tang Liu
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Abstract
The subject application relates to a semiconductor package device, which includes a first conductive layer; a semiconductor wall disposed on the first conductive layer; a first conductive wall disposed on the first conductive layer; and an insulation layer disposed on the first conductive layer and between the semiconductor wall and the first conductive wall.
Claims8
A semiconductor package device, comprising:
- a first conductive layer having conductive grains of a first average size;
- a first conductive wall disposed directly on the first conductive layer, the first conductive wall having conductive grains of a second average size;
- a semiconductor wall disposed on the first conductive layer and at one side of the first conductive wall;
- and
- an insulation layer disposed on the first conductive layer,
- wherein the first average size is different from the second average size.
3 more elements
Dependencies are inferred from the claim text.