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US 11,079,699 B2Granted
Exposure head and image forming apparatus
AssigneeCanon Kabushiki Kaisha
InventorYasutomo Furuta
Life of this patent
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Abstract
An exposure head that exposes a photosensitive member to light includes a plurality of light-emitting element array chips mounted on one surface of a board, a connector mounted on the other surface of the board, and a first driver IC and a second driver IC that are connected to the connector and drive the light-emitting element array chips, wherein the first driver IC is placed on one side of the board with respect to the connector in the longitudinal direction of the board, and the second driver IC is placed on the other side of the board with respect to the connector in the longitudinal direction of the board.
Claims18
An exposure head that exposes a photosensitive member to light, comprising:
- a first board that is a long board;
- a plurality of light-emitting element array chips that are mounted on one surface of the first board and arranged along a longitudinal direction of the first board;
- a connector mounted on the other surface opposite to the one surface of the first board, the connector being configured to make connection to an image processing IC mounted on a second board different from the first board;
- a first driver IC mounted on the other surface opposite to the one surface of the first board, the first driver IC being arranged on one side of the first board with respect to the connector in the longitudinal direction of the first board, the first driver IC being connected to the connector and being configured to drive the light-emitting element array chips;
- and
- a second driver IC mounted on the other surface opposite to the one surface of the first board, the second driver IC being arranged on the other side of the first board with respect to the connector in the longitudinal direction of the first board, the second driver IC being connected to the connector and being configured to drive the light-emitting element array chips, wherein
- the first driver IC, the second driver IC, and the connector are mounted on the first board in an area that overlaps an area where the plurality of light-emitting element array chips are mounted, along a vertical direction vertical to the surfaces of the first board,
- the first driver IC drives a device group including a plurality of light-emitting element array chips arranged on a side where the first driver IC is placed with respect to a center of the first board in the longitudinal direction of the first board among the plurality of light-emitting element array chips arranged along the longitudinal direction, and
- the second driver IC drives a device group including a plurality of light-emitting element array chips arranged on a side where the second driver IC is placed with respect to the center of the first board in the longitudinal direction of the first board among the plurality of light-emitting element array chips arranged along the longitudinal direction.
6 more elements
An image forming apparatus comprising:
- a photosensitive member;
- an exposure head configured to expose the photosensitive member to light based on image data to form an electrostatic latent image on the photosensitive member;
- and
- a development device configured to develop the electrostatic latent image formed on the photosensitive member with toner, wherein
- the exposure head includes:
- a first board that is a long board;
- a plurality of light-emitting element array chips that are mounted on one surface of the first board and arranged along a longitudinal direction of the first board;
- a connector mounted on the other surface opposite to the one surface of the first board, the connector being configured to make connection to an image processing IC mounted on a second board different from the first board;
- a first driver IC mounted on the other surface opposite to the one surface of the first board, the first driver IC being arranged on one side of the first board with respect to the connector in the longitudinal direction of the first board, the first driver IC being connected to the connector and being configured to drive the light-emitting element array chips;
- and
- a second driver IC mounted on the other surface opposite to the one surface of the first board, the second driver IC being arranged on the other side of the first board with respect to the connector in the lengthwise direction of the first board, the second driver IC being connected to the connector and being configured to drive the light-emitting element array chips, wherein
- the first driver IC, the second driver IC, and the connector are mounted on the first board in an area that overlaps an area where the plurality of light-emitting element array chips are mounted, along a vertical direction vertical to the surfaces of the first board,
- the first driver IC drives a device group including a plurality of light-emitting element array chips arranged on a side where the first driver IC is placed with respect to a center of the first board in the longitudinal direction of the first board among the plurality of light-emitting element array chips arranged along the longitudinal direction, and
- the second driver IC drives a device group including a plurality of light-emitting element array chips arranged on a side where the second driver IC is placed with respect to the center of the first board in the longitudinal direction of the first board among the plurality of light-emitting element array chips arranged along the longitudinal direction.
11 more elements
Dependencies are inferred from the claim text.