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US 11,079,690 B2Granted
Apparatus and method for processing a substrate using the same
AssigneeXia Tai Xin Semiconductor (Qing Dao) Ltd.
InventorsHyun-Suk Yang, Soo-Hyoung Kim, Sung-Uk Kim, Byung-In Kwon
Life of this patent
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Abstract
An apparatus for processing the substrate includes a substrate stage and a source. The substrate stage is configured to support a substrate thereon. The substrate stage includes a substrate support formed with a first opening therein. The first opening is an annular opening. The source is coupled to the first opening and is configured to supply first gas/air to a bottom surface of the substrate through the first opening.
Claims10
An apparatus for processing a substrate, comprising:
- a substrate stage configured to support a substrate thereon, the substrate stage including a substrate support formed with a plurality of first openings, a plurality of second opening, and a center opening therein, wherein each first opening is an annular opening, each second opening is an annular opening, the center openings is a circular opening, the first openings and the second opening are alternately arranged, the center opening is disposed at a center of an innermost one of the first openings, a width of each first opening is equal to a width of each second opening, a width of the center opening is larger than the width of each first opening;
- a source coupled to the first openings and configured to supply first gas/air to a bottom surface of the substrate through the first openings to elevate the substrate on the substrate support;
- and
- a vacuum coupled to the second openings and configured to evacuate second gas/air between a top surface of the substrate support and the bottom surface of the substrate through the second openings to stabilize a position of the substrate.
1 more element
A method of processing a substrate, the method comprising:
- providing an apparatus, the apparatus comprising a substrate stage, the substrate stage including a substrate support formed with a plurality of first openings, a plurality of second opening, and a center opening therein, wherein each first opening is an annular opening, each second opening is an annular opening, the center openings is a circular opening, the first openings and the second opening are alternately arranged, the center opening is disposed at a center of an innermost one of the first openings, a width of each first opening is equal to a width of each second opening, a width of the center opening is larger than the width of each first opening;
- supplying first air/gas through the first openings;
- drawing second gas/air through the second openings;
- receiving a substrate on the substrate support;
- maintaining the substrate at a center of the substrate support;
- performing a process on the substrate.
3 more elements
Dependencies are inferred from the claim text.