Semiconductor device and manufacturing method of the same
AssigneeRenesas Electronics Corporation
InventorsTetsuya Iida, Yasutaka Nakashiba
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AssigneeRenesas Electronics Corporation
InventorsTetsuya Iida, Yasutaka Nakashiba
Estimating the term…
According to the present invention, a first semiconductor chip includes a semiconductor substrate, an optical waveguide formed on an upper surface of the semiconductor substrate, and a concave portion formed in the semiconductor substrate in a region that differs from a region in which the optical waveguide is formed. A second semiconductor chip includes a compound semiconductor substrate, and a light emitting unit formed on an upper surface of the compound semiconductor substrate and emitting a laser beam. The second semiconductor chip is mounted in the concave portion of the first semiconductor chip, and a pedestal which is an insulating film is formed between a bottom surface of the concave portion and a back surface of the compound semiconductor substrate.
A semiconductor device comprising:
Dependencies are inferred from the claim text.