Resistivity-based calibration of in-situ electromagnetic inductive monitoring
AssigneeApplied Materials, Inc.
InventorsKun Xu, Ingemar Carlsson, Shih-Haur Shen, Boguslaw A. Swedek, Tzu-Yu Liu
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AssigneeApplied Materials, Inc.
InventorsKun Xu, Ingemar Carlsson, Shih-Haur Shen, Boguslaw A. Swedek, Tzu-Yu Liu
Estimating the term…
A first resistivity value and a correlation function relating thickness of a conductive layer having the first resistivity value to a signal from an in-situ monitoring system are stored. A second resistivity value for a conductive layer on a substrate is received. A sequence of signal values that depend on thickness of the conductive layer is received from an in-situ electromagnetic induction monitoring system that monitors the substrate during polishing. A sequence of thickness values is generated based on the sequence of signal values and the correlation function. For at least some thickness values of the sequence of thickness values adjusted thickness values are generated that compensate for variation between the first resistivity value and the second resistivity value to generate a sequence of adjusted thickness values. A polishing endpoint is detected or an adjustment for a polishing parameter is determined based on the sequence of adjusted thickness values.
A method of calibrating an in-situ electromagnetic induction monitoring system, comprising:
A computer program product for calibrating an in-situ electromagnetic induction monitoring system, the computer program product tangibly encoded on a non-transitory computer readable media, comprising instructions to cause a computer system to:
A polishing system, comprising:
Dependencies are inferred from the claim text.