Compact sensor package

A magnetic sensor arrangement, comprising:

• a component board having a first vertical thickness and having an accommodation hole for accommodating at least part of a magnetic field generating structure;
• a magnetic sensor package or a bare semiconductor chip having a second vertical thickness, mounted on the component board, and comprising a sensing element configured for sensing a magnetic field generated by the magnetic field generating structure;
• wherein the sensing element is located vertically not more than one third of the sum of the first vertical thickness and the second vertical thickness away from a vertical center vertically in the middle between an upper end and a lower end of an assembly composed of the component board and the magnetic sensor package or the bare semiconductor chip mounted thereon.